Vendors
News

27.09.2017

Make the Most of Big Data & Information Sharing in the IoT with PLM
A little as a year ago, small and medium sized enterprises (SMEs) were being told about the benefits of big data, but most didn’t know where to start or have the time and expertise to produce insights that actually impacted their business.
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News

21.09.2017

Intel Custom Foundry certifies Mentor physical verification tools for 22FFL FinFET low power process
Mentor, a Siemens business, announced it has achieved tape-out sign-off certification of the Calibre® physical verification platform and Analog FastSPICE™ (AFS™) circuit simulation platform for the new Intel® 22FFL (FinFET low power) process technology.
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News

15.09.2017

Announcing Thermal-Mechanical Analysis in Sherlock Version 5.
DfR Solutions announced the next release of Sherlock Automated Design Analysis™ software - Version 5.3. Advanced features include Thermal-Mechanical Analysis. This advanced new capability provides the ability to capture system-level effects on solder joint reliability during temperature cycling.
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Events

26.10.2017

Upgrade to Custom ASIC
Arm, imec.IC-link and Mentor are world leaders in the ASIC ecosystem and have joined forces to deliver a seminar for designers, engineering directors & managers and product managers to understand the latest options to deliver a product based on a custom ASIC.
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Events

26.10.2017

A Novel Approach to Reducing Heatsink Mass
A systematic approach in identifying and removing underperforming parts of a heatsink will be presented. The approach entails examination of the FloTHERM predicted thermal bottleneck distribution within the heatsink geometry, removal of a small portion of the geometry where the thermal bottleneck is lowest, simulating the new bottleneck distribution and repe...
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Events

07.11.2017

FloEFD Simulation Conference 2017
The FloEFD Simulation Conference 2017 is the second annual global event about FloEFD, the most popular frontloading Computational Fluid Dynamics (CFD) solution in the industry. The conference covers many types of applications and industries including automotive, aerospace, telecommunication, consumer products and general manufacturing.
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